The Performances of Thermal Silica

Time : Jan 30 2015Source :analogtechnologies Author : Analog Click :
      The forms of thermal conductivity silicone are grease and solid. And there are also many different kinds of materials can be competent forapplicationsof the thermal conductivity silica. When producing thermal silica, there are some factors to consider. 
      
      Thermal conductivity is also known as thermal efficiency. As a goodthermal conductivity material, it must be able to absorb heat quickly, and alsocan radiate heat. We usually use the unit of thermal conductivity to measure the efficiency of thermal silica. If the thermal conductivity coefficient of a material is high, it is very suitable for the thermal conductivity materials. And it will be very effective to transfer the heat of a processor to radiators. Please look at the following two figures.
      
      In the left picture, there is no thermal silica, so the heat cannot be dissipated out smoothly. And in the right picture, there is thermal silica, so the heat can be dissipated very smoothly. Besides thermal conductivity, we also have many other demands of thermal silica, such aselectrical conductivity, fluid properties and so on.
      
      Electrical conductivity is the conductive properties of a material. The electrical conductivity of a metal is very good, but that of wood or rubber is very weak. As the thermal conductivity of materials in the computer, we should try to choose those weakconductivity materialsbecause in the surrounding area of a processor, there are a lot of other electronic components in the work. If the thermal conductivity materials flow to other places, that can cause short circuit and damage the equipment. Thus, many common thermal products are based on silica gel because the conductivity is very weak.
      
      About fluid properties, because of heat and pressure,chemical compound of thermal silica will decentralized extension. Thermal silica gel with small molecular structure can fill the small gap, which can increase the heat conduction area between processors and heat sinks.