In this paper, the air cooling method of TEC is mainly introduced. 1.Air national convection cooling In many small TECs, heat exchange system with air national convection cooling is usually used, which needs a certain heat sink as the heat exchanger. The heat moved by cooling medium is absorbed by heat exchange of the cold end heat absorber and air around. Then based on the heat conduction of connection pieces and insulation layers, the heat is taken away by thermopile cold end and after that th...(more)
In practical applications, TEC can sustain work through continuous heat change of heat exchanger and cold and heat source. When the system works, the heat density of cold and hot ends can be up to 10 4 W/m 2 , so effective operation is strongly dependent on heat transfer performance of cold and hot end. The heat dissipation of the cold end is more important than the hot ends. Suppose the heat dissipating capacity of the cold end is q 1 , the heat dissipating capacity of hot end is q 2 and the el...(more)
Although the two cooling systems comply with the same thermal dynamics, a TEC has many obvious advantages: simple structure, small volume, light weight, high reliability, long service lifetime, no noise, small power consumption, low cost and so on. Whats more, there is no need for TECs to fill chemical consumables, which the mechanical cooling method needs. Because of no moving parts, there is no wear and tear for TEC s. Thus TEC is an ideal cooling method, which can gradually take the place of ...(more)
Based on the Peltier effect, thermoelectric cooler (TEC) is an energy conversion process, which uses electric energy as power. When the direct current is through the loop made of two different conductive materials, the endothermic phenomenon will be generated in the node, and when the current is in the opposite direction, the exothermic phenomenon will be generated. As the Peltier effect of semiconductor materials is particularly significant, currently, the TEC module is usually composed of semi...(more)
In practical application, the thermoelectric modules are often placed inside of devices, and even they can be directly combined with devices needing refrigeration into a whole. For example, in optical application, the thermoelectric module can be a part of a detector or diode; in a semiconductor device, it can become a whole with the ceramic package. This lays the foundation for developing composite materials with temperature control-structure integration or even intelligent temperature control ...(more)
In the ion conduction type conductor, the carrier may be positive ion or negative ion. In the electronic conduction type conductor, carrier is electron and current can be formed by electron movement. With the increasing of carrier concentration, thermoelectric coefficient will reduce and thermal conductivity will increase. In the thermal coefficient, the lattice thermal conductivity P (about 90%) is irrelevant to the carrier concentration, while the electron thermal conductivity e is proportiona...(more)
Although thermoelectric cooling technology has been developed very fast, there are still many problems that need resolution. Because of the material constraints, the cooling capacity of thermoelectric cooler (TEC) is limited and its cooling efficiency is too low. With the increase of the required temperature difference, the more the TEC series is, the lower the cooling efficiency is. So TEC cannot completely replace the traditional cooling technology, which can only be used in the small cooling...(more)
Until 1950s, with the rapid development of semiconductor thermoelectric mateials with good performances, the efficiency of thermoelectric effect was improved so greatly that the thermoelectric refrigeration and the thermoelectric generation entered into the field of engineering practice. When comparing with the existing compression refrigeration or absorption refrigeration, the thermoelectric cooler ( TEC ) depends on the heat transfered by electrons to achieve refrigeration. It has the followin...(more)
