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Time : 2015-05-29 11:00Source :analogtechnologies Author : Analog Click :

(c) Use proper pre tin in the soldering area of the surface of the heat sink. Thus, the melting point of the solder shall be lower or equal to the maximum operating temperature of the thermoelectric cooler. When plating tin on the heat sink, we shall keep the temperature of the heat sink in a proper temperature, which could melt the solder but not exceed the maximum operating temperature of the TEC .

(d) Cover the solder flux on the hot end of the TEC, and then place the TEC on the pre tin area of the heat sink. Keep the liquid solder to be float and then rotate the TEC to make the solder and the TEC contact each other. If the TEC tends to sink in the solder, it indicates that the solder is not enough. At this time, take the TEC down and add more solder on the heat sink.

(e) After several seconds of step d, the surface of the TEC has been soaked fully. Put a heavy object on the TEC or use a chucking to be fastened in the required position. Remove the heat sink from the heat resource and cool down the TEC. After fully cooling. Then remove the residual flux by deoiling the TEC.

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