Thermoelectric cooler dynamic cooling model analysis

During cooling process, thermoelectric cooler (TEC module) has dynamic changes in its current, voltage, and temperatures in hot and cold ends, so its performance changes dynamically too. The research on dynamic cooling effect of TEC is good to improve the operating performances of these devices. 

Traditional static concentrated parameter analysis cannot tell accurately the system state change, while dynamic analysis can reflect all the state changes of the components in the system. Based on dynamic perspectives, designing, producing and making dynamic simulation calculation can reduce the blindness for R&D, shorten the research period and save research cost.

As shown in the figure below, a typical thermoelectric cooler include a TEC module, hot end heat sink, cold end heat sink as well as galvanic pile. A TEC module consists of multiple couple of P-N type thermoelectric materials, which are soldered or pressed between two ceramic plates. Cold end heat sink absorbs the heat dissipated from the load and then transfer the heat from galvanic pile to hot end. At last, the heat will be dissipate to the environment air through hot end heat sink.