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Time : 2015-04-23 10:33Source :analogtechnologies Author : Analog Click :

With the shrinking volume of electronic component and the development of its performance and speed, the energy consumption of chips is larger and larger. The excessive temperature will make the component subjected to excessive thermal expansion stress, which can result in its structure damage or even the component burning out. Due to the uneven distribution of the chip power density, local hot spots will be generated. According to statistics, more than 55% of electronic equipment failure is due to excessive temperature. Take space telescope for instance. If the operation temperature of CCD and other electronic components is reduced, it can contribute to reduce dark noise, improve sensitivity and ensure detection ability. Therefore, it is necessary for components with thermal consumption as well as the whole system to use appropriate cooling techniques, which can control temperature and can ensure the normal operation of electronic equipment or system.

For the refrigeration of electronic components，especially the high power density of integrated circuit components, the traditional cooling method has been replaced by TEC(thermoelectric cooler) because the traditional method cannot meet the growing  requirements of chip heat. TEC has many advantages of simple structure, no moving parts, no noise, no pollution, high reliability, long service lifetime, low cost, flexible control and low power consumption. What’s more, it has both heating capacity and cooling capacity. Therefore, thermoelectric cooling technology is a good choice for electronic components.

Next : Characteristic analysis of TEC refrigeration cycle (I) Last : Manufacturing technologies for improving the performance of TECs (Ⅱ)