Thermoelectric cooler (TEC) is built on the Peltier effect. Due to the internal structure features of semiconductor material, it has more obvious thermoelectric effects than other metals do. Therefore, semiconductor material is usually used for making TEC . The cooling capacity of a pair of couple, which consists of P-type and N-type semiconductor, is fairly small. For example, the cooling capacity of the couple (6mm 7mm) is only 0.92~1.16W. In order to obtain more cooling capacity, many pairs o...(more)
(c) Use proper pre tin in the soldering area of the surface of the heat sink . Thus, the melting point of the solder shall be lower or equal to the maximum operating temperature of the thermoelectric cooler. When plating tin on the heat sink, we shall keep the temperature of the heat sink in a proper temperature, which could melt the solder but not exceed the maximum operating temperature of the TEC . (d) Cover the solder flux on the hot end of the TEC, and then place the TEC on the pre tin area...(more)
When proper measures have been adopted to protect the TEC s from being overheated, we can solder the TEC with metalized surface to thermoelectric components. In order to prevent the TEC from excessive mechanical force, solder one surface (usually hot end) to a component with rigid structure. Its worth noted that when we solder the TEC to a rigid structure component, other components or small circuits shall be soldered in the cold end of the TEC, which will not connect to the external structure r...(more)
Thermoelectric cooler (TEC) is built due to the Peltier effect, which both have the abilities of heating and cooling. When comparing with the traditional cooling method, vapor compression cooling, TEC has the following features: 1) TECs need no refrigerant, so there is no leakage or pollution. 2) Because of no mechanical rotation parts, when TEC works, there are no noise, no wear, long service life, with high reliability and convenient maintenance. 3) The cooling speed and temperature can be adj...(more)
The cooling principle of TEC is shown in figure 1. P and N type semiconductors are sandwiched between metal plates, which can form a pathway. Under the action of external electric field, the hole of P type in the point(a) needs to absorb certain energy to improve its own potential energy and then goes into P type semiconductor, so the temperature of the junction can be decreased and the cold contact point is formed. But the hole in the point(b) needs to release the excess energy to enter theshee...(more)
In the closed circuit with two different metals, if the temperature of the two contact points keeps different, electric potential difference will generate and at the same time, there will be current through the closed circuit, which is called Seebeck effect. Conversely, in the same closed circuit, when the direct current is supplied, one contact point becomes cold and the other one gets hot, which is called Peltier effect or thermoelectric effect. This phenomenon can directly lead to the inventi...(more)
With the rapid development of science and technology, technical difficulties about material system and manufacturing technology have been solved. At home, there has been ceramic technology to produce the TEC cooling materials and the standard of the materials can be in the international advanced level. Whats more, the merit of figure of high efficient TEC with Chinas independent intellectual property rights has improved a lot and can be over 1310-3K. Now when in the temperature difference of 50℃...(more)
Thermoelectric cooler (TEC) is an ancient technology. As early as in the 1950s, TEC has once set off a boom. When it is connected to a power supply, it can become cold, which is very popular among home appliance manufacturers. However, because of the poor performance of components, it failed to be applied in actual life. The key, which determines the rise of decline of materials and process of TEC, is to improve figure of merit and the cooling effect of the hot and cold end. In order to meet the...(more)
