Some other heat-dissipation methods of TEC

Time : May 19 2015Source :analogtechnologies Author : Analog Click :
1.Using endothermic phenomenon of material melting
When a material is melting, it will absorb the heat from the hot end of thermopile in the isothermal condition. The isothermal characteristic is the necessary condition of maintaining the cold end constant. The time for the melting stage is the temperature constant time of the cold end. 
Because of different material thermal conductivities, the heat transfer temperature difference is also different, the thermal conductivity is low and the temperature difference is high. It is suitable for TECs only in a relatively short working time or intermittent work situations.


2.Using endothermic phenomenon of the heat capacity 
The material with great heat capacity can absorb the exhausted heat from the hot end and make the temperature increase. At this point, the heat transferring is unstable. With the time going by, the temperature of the endothermic material becomes high and the hot end temperature also become high. At the same time, the amount of heat change between the endothermic material and the air around also changes with time.

 
3.Using the latent heat of vaporization from materials
Using the big latent heat of vaporization from a lot of liquid, the hot end can be dissipated. In order to make TEC reach the necessary low temperature level, the insulating materials can be used as the outside packing of TEC working space, such as foam, etc.


4.The derived heat dissipation of heat conduction strips 
Basically, components with the cooling requirements can contact with the heat conduction strips directly or indirectly. The heat conduction strips can be directly used as cooling devices if the heating power is not high or the environment permits. The advantage of this way is low cost, high reliability, but the disadvantage is the requirement of high temperature gradient for heat dissipation.

5.The heat dissipation of thermo-syphon
In the small temperature gradient, the thermo-syphon is a heat transfer element, which can transfer heat from one place to another. The thermo-syphon belongs to “two times heat change” and its heat transfer ability mainly depends on thermal resistance between heat medium pipes and working medium, if the total thermal resistance is bigger than conventional heat sink, the heat ability will decrease. The remaining non condensable gas and appropriate saturated vapor pressure have great effects on the performance of thermo-syphon radiator. What’s more, the working temperature is determined by the boiling point of liquid because the temperature is the necessary condition of selecting thermo-syphon.

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