In practical application, the
thermoelectric modules are often placed inside of devices, and even they can be directly combined with devices needing refrigeration into a whole. For example, in optical application, the thermoelectric module can be a part of a detector or diode; in a semiconductor device, it can become a whole with the ceramic package. This lays the foundation for developing composite materials with temperature control-structure integration or even intelligent temperature control composite materials.
Especially with the further miniaturization of the refrigeration module structure, the adverse effects of internal contact layer resistance, heat conduction and thermal radiation will be more significant. Therefore, the thin film integrated structure with strong compatibility will become the mainstream development direction of microelectronic cooling technology.
Thus,
thermoelectric cooler (TEC) with the integrated design and integration technology of aerospace vehicles in the aspects of function and structure satisfies the future development trend of thermoelectric cooling technology, especially in the application of aerospace. Based on composite materials of TEC temperature control and intelligent temperature control, the organic combination of TECs, structural materials and functional materials is a major development direction of future application of thermoelectric cooling technology.
If you have any questions and suggestions about TECs, please feel free to contact us. We will be very happy to receive your feedback.
Our web site is
http://www.analogtechnologies.com/
