The thermodynamic law can be applied to both
TEC modules and traditional mechanical cooler.
In mechanical cooling unit, use compressor to increase the liquid pressure, which enable the cryogen to circulate in the system. Then, the cryogen curs in the frozen area and then the temperature of the frozen area is reduced when the cryogen absorbs the heat during sublimation process. The heat absorbed by the cryogen is transferred to the compressor and then to the ambient environment through cryogen compression process. Correspondingly, in thermoelectric system, semiconductor materials play the role of liquid cryogen; heat sink replaces the condenser; the compressor is replaced by a DC power. Input a DC power to the thermoelectric cooler, the electrons in the semiconductor material make movements. At the cold end of the semiconductor material, the heat is absorbed by the moved electrons, which will move to the other end of TEC modules, i.e. hot end. Since the hot end of TEC modules is connected to a heat sink, the heat will be transferred to the heat sink and then to the ambient environment.
The common semiconductor material for TEC modules is bismuth telluride. In this industry, P type and N type bismuth telluride bulk or device can be achieved through doping process.
To be continued...
