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Time : 2015-05-18 11:09Source :analogtechnologies Author : Analog Click :

In some specified applications, the main method is to use a special high thermal conductive epoxy resin binder. Since the coefficients of thermal expansion of the ceramics of TECs, heat sink and the cooled object, it's not recommended to use epoxy resin binder in large TECs. The detailed steps are as follows:

(a) Flat the installing surface of the TEC by lathe machine or polishing method. Although it doesn't need high flatness when using epoxy resin, but usually the surface should be flat as much as possible.

(b) Clean the TEC and all the installing surfaces in order to make sure there are no burr, dust or grease dirt. Pretreatment to the surfaces shall be made based on the requirements of the epoxy resin manufacturer.

(c) Overlay a thin epoxy resin on the hot end of the TEC, and put the hot end in a proper position of the heat sink. Press and rotate the TEC repeatedly till some resistance can be felt.

(d) Put a heavy object on the TEC or use a chucking to be fully cured. If you want to cure it in a roaster, make sure the heating temperature will not exceed the operation temperature of the TEC.

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