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Thermal Pad

Time : 2015-01-30 09:28Source :analogtechnologies Author : Analog Click :
     Thermal pad has good heat conduction ability and high level pressure-tolerant, and it is the substitute of thermal grease. Because of having certain flexibility, it has good bonding between a power device and an aluminum heat sink, so it can achieve the best purpose of heat conduction and heat dissipation. In the industry, thermal pad is also called the thermal silica film, thermal conductive silicone pad, insulating heat conducting sheet, soft cooling pad and so on.

     As the electronic equipmentcontinue to integrate more powerful features into smaller components, temperature controlhas become one of the critical design challenges, that is, in the condition of austerityframework and the smaller and smalleroperation space, how to effectively take away more heat produced by larger unitpower. The designer has been working to improve all kinds of server CPU speed and processing ability, which requires a microprocessor constantly improve the radiating performance.But in other applications, such as video game consoles, image equipment and high-definition digital application thatrequire high performance support, the stronger computing capability demand is also needed,so the chip maker pay more attention to heat conducting material (thermal pad) and the other technology that can take away the excess heat. As we all know, junction operating temperature has great influence on the circuit durability, and if the temperature slightly lowers(10-15℃), the equipment life can increase two times. And lower operating temperature can also shorten the delay, which is helpful to improve the processing speed. What’s more, lower temperature can reduce idle power dissipation and decrease the total power consumption. 

    From the engineering point of view, the thermal pad has the profile design to match the material irregular surface. Using heat conduction material with high performances, it can eliminate the air gap and improve the overall capacity of thermal conversion, so the devices can work in lower temperature.